宋復(fù)斌

講師介紹

● 講師介紹：
宋復(fù)斌, 博士, 于2002年和2007年在北京航空航天大學(xué)（BUAA）和香港科技大學(xué)（HKUST）分別獲得材料學(xué)碩士及機(jī)械工程博士學(xué)位。2002-2004年之間，他任職于摩托羅拉半導(dǎo)體事業(yè)部（現(xiàn)為飛思卡爾半導(dǎo)體）從事電子產(chǎn)品封裝方面的開(kāi)發(fā)及研制。2004-2012年之間，宋復(fù)斌博士在香港科技大學(xué)先進(jìn)微系統(tǒng)封裝中心電子封裝實(shí)驗(yàn)室任職為資深/總工程師和香港科大深圳電子材料與封裝實(shí)驗(yàn)室的資深研究員。他的研究領(lǐng)域覆蓋了封裝材料的開(kāi)發(fā)測(cè)試、電子器件的可靠性研究和失效分析等。目前主要負(fù)責(zé)先進(jìn)制造工程和質(zhì)量改善解決方案等工作。宋博士是美國(guó)國(guó)際電機(jī)電子工程師學(xué)會(huì)（IEEE）, 表面組裝技術(shù)協(xié)會(huì)(SMTA) 和美國(guó)機(jī)械工程師學(xué)會(huì)（ASME）會(huì)員，以及美國(guó)質(zhì)量學(xué)會(huì)(ASQ)的資深會(huì)員。他在國(guó)內(nèi)外學(xué)術(shù)期刊及會(huì)議論文集上發(fā)表了超過(guò)50篇技術(shù)論文并多次獲得最佳論文獎(jiǎng)，且與其他研究學(xué)者合作撰寫了兩本微電子封裝與組裝方面的書(shū)章。
Dr. Fubin SONG received his Ph.D degree in Mechanical Engineering from the Hong Kong University of Science & Technology (HKUST) in 2007 and M.S. degree in Material Science & Engineering from Beijing University of Aeronautics and Astronautics (BUAA) in 2002. From 2002 to 2004, he was with Division of Motorola's Semiconductor Products Sector (now Freescale Semiconductor) in advanced electronic packaging and development. From 2004 to 2012, Dr. Song was the senior / chief technical officer in Center for Advanced Microsystems Packaging (CAMP)/Electronic Packaging Laboratory (EPACK)/HKUST, responsible for advanced packaging related process development, failure analysis and solder joint reliability. He also served as a senior research fellow of HKUST Shenzhen Electronic Materials & Packaging Laboratory from 2009 to 2012. Currently, responsible for advanced engineering and quality solution. He has published over 50 technical papers in international journals/conferences and received several best paper awards, including Best International Conference Paper Award from IPC APEX, Outstanding Paper Award from ICEP, and Best Paper Award of SMTA China South Technology Conference 2011, etc. He also wrote two chapters for books on the solder joint reliability.

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