焊點(diǎn)可靠性，POP組裝與空洞控制培訓(xùn)班

焊點(diǎn)可靠性，POP組裝與空洞控制培訓(xùn)班(李寧成)課程介紹：

您能從此課程中學(xué)到哪些內(nèi)容：
本課程涵蓋了電子封裝和組裝應(yīng)用中軟釬焊焊點(diǎn)的可靠性表現(xiàn)。討論了焊點(diǎn)的機(jī)械失效模式機(jī)制和提高可靠性的方法。在電可靠性方面，詳細(xì)討論了由于微型化的快速發(fā)展而導(dǎo)致的嚴(yán)重的焊點(diǎn)，銅柱以及再分布線的電遷移問(wèn)題。在組件類(lèi)型方面，詳盡地回顧了POP以及其他的底部終止組件封裝方式，包括材料選擇，工藝，可靠性，和提高可靠性的方法。介紹了環(huán)氧助焊劑這種最具潛力的解決方法，并將其與其他解決方案進(jìn)行比較。最后，以QFN熱板設(shè)計(jì)為實(shí)例，講授了回流焊中，特別是在PoP和其他更容易產(chǎn)生氣孔的封裝方式中氣孔控制方法。這些控制方法包括在材料，工藝和設(shè)計(jì)方面的考慮。
What You Can Learn From This Course:
This course covers the solder joint reliability performance for packaging and assembly applications. The mechanism of joint mechanical failure modes and approaches for improving reliability will be discussed. As to the electrical reliabilities, electromigration will be discussed in great details on solder, Cu pillar, and redistribution line due to the rapid advancement of miniaturization and the resultant serious electromigration problems. Regarding the component type, Package on package (PoP) as well as other bottom-terminated components will be reviewed thoroughly, including materials selection, processes, reliabilities, and approaches of enhancing the reliability. Being the solution with the highest potential, epoxy flux will be introduced and will be compared with other solutions. Finally, voiding control at reflow soldering, particularly at PoP and other packages more prone to have voids, will be instructed. The control includes considerations from materials, processes, and designs, with QFN thermal pad design serving as a demonstration on control.

誰(shuí)應(yīng)該參加此課程：
凡對(duì)電子封裝和組裝應(yīng)用中實(shí)現(xiàn)焊點(diǎn)高可靠性（特別是對(duì)PoP封裝）感興趣的，并想了解如何實(shí)現(xiàn)的焊點(diǎn)高可靠性的人員均可參加本課程
Who Should Take This Course:
Any one who care about achieving high reliability solder joints for packaging and assembly applications, particularly that of PoP, and like to know how to achieve it should take this course.

老師介紹：李寧成
Ning-Cheng Lee，1973國(guó)立臺(tái)灣大學(xué)化學(xué)專(zhuān)業(yè)學(xué)士，1981年University of Akron高分子專(zhuān)業(yè)博士，現(xiàn)任美國(guó)Indium 公司技術(shù)副總裁。Ning-Cheng Lee博士于1986 年加入Indium 公司，在此之前，曾先后就職于莫頓化學(xué)公司 和SCM 公司。他對(duì)于SMT 行業(yè)中助焊劑和焊膏的研發(fā)有20 多年的經(jīng)驗(yàn)，并在底部填充灌封膠和粘合劑的研發(fā)方面也具有極為豐富的經(jīng)驗(yàn)。
Ning-Cheng Lee博士編寫(xiě)了 《Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies》（Newnes出版）一書(shū)，參與編寫(xiě)了《Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials》（McGraw-Hill出版），同時(shí)還編寫(xiě)了一些無(wú)鉛焊接書(shū)籍的部分章節(jié)。他于1991年獲SMT雜志頒發(fā)的最佳SMI國(guó)際研討會(huì)論文獎(jiǎng)，1993年和 2001年獲SMTA頒發(fā)的最佳SMTA國(guó)際研討會(huì)論文獎(jiǎng)，2008年獲IPC在美國(guó)APEX會(huì)議上頒發(fā)的優(yōu)秀論文獎(jiǎng)， 2010年獲SMTA China South頒發(fā)的最佳論文獎(jiǎng)，2002年，被提名為SMTA的榮譽(yù)會(huì)員，2003年獲Soldertec全球無(wú)鉛焊料獎(jiǎng)， 2006年獲CPMT杰出技術(shù)成就獎(jiǎng)，2007年CPMT杰出講師，2009年SMTA杰出作者，2010年獲CPMT電子制造技術(shù)獎(jiǎng)。Ning-Cheng Lee博士還是SMTA董事會(huì)成員，并擔(dān)任《Soldering and Surface Mount Technology》和《Global SMT & Packaging》雜志的編輯顧問(wèn)，《IEEE Transactions on Electronics Packaging Manufacturing》的助理主編。他發(fā)表過(guò)大量的文章，經(jīng)常應(yīng)邀參加國(guó)際論壇研討會(huì)并對(duì)一些研究成果做簡(jiǎn)短的介紹或者重要的演講。
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He served on the board of governors for CPMT, serves on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

本課程將涵蓋以下主題：
• 軟釬料焊點(diǎn)可靠性
熱疲勞過(guò)程中焊點(diǎn)的結(jié)構(gòu)與性能關(guān)系以及失效模式，易脆性和提高可靠性的解決方案
• 電遷移
在無(wú)鉛，錫鉛，銅的支柱，和RDL系統(tǒng)中的基本原理和表現(xiàn)
• POP和底部終止封裝
工藝的考慮，材料的選擇及可靠性
• 環(huán)氧助焊劑 - POP和其他面陣封裝中可靠性解決方法
工藝，應(yīng)用以及與其他替代方案的比較
• 回流焊過(guò)程中氣孔的控制
氣孔產(chǎn)生機(jī)制和控制方法以及在QFN中的應(yīng)用 • Solder Joint Reliability
– Structure-property relationship and failure modes for thermal fatigue, fragility and solutions for reliability improvement
• Electromigration
– Fundamental and performance in SnPb, Pb-free, Cu-pillar, and RDL systems
• PoP & Bottom Terminated Packages
– Process considerations, material selection & reliabilities
• Epoxy Flux – Reliability Solution for PoP and other Area Array Packages
– Process, applications, and comparison with alternative solutions
• Voiding Control at Reflow Soldering
– Voiding mechanisms and control, and application on QFN

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