無鉛生產(chǎn)所帶來的問題及解決方法培訓(xùn)班

無鉛生產(chǎn)所帶來的問題及解決方法培訓(xùn)班(李寧成)課程介紹：

您能從此課程中學(xué)到哪些內(nèi)容：
這個(gè)課程覆蓋了電子行業(yè)在無鉛轉(zhuǎn)換中發(fā)生的焊接相關(guān)的問題。更重要的是它也體現(xiàn)了近年來行業(yè)在盡力解決這些問題作出的努力和成果。強(qiáng)調(diào)了波峰焊，選擇性波峰焊和維修的制造工藝。講述表面處理引起的問題，特別是錫須。關(guān)于焊料的選擇，會(huì)提及什么樣的合金焊料是合適的，權(quán)衡利弊，如何選擇及評(píng)估。詳細(xì)討論那些難以避免的問題例如混合合金及便攜設(shè)備對(duì)沖擊損壞的敏感性. 基于有價(jià)值的案例提供建議.最后，回顧近來在對(duì)可靠性以及機(jī)械性關(guān)鍵因素的研究，來回答如何實(shí)現(xiàn)高可靠性的問題。
李寧成博士最新出版了《再流焊工藝和缺陷偵斷：SMT，BGA，CSP和Flip Chip技術(shù)》。合著編寫了《無鉛，無鹵素和導(dǎo)電膠材料的電子制造》。同時(shí)，他還編寫了一系列關(guān)于無鉛焊接書籍的章節(jié)。他榮獲SMTA兩項(xiàng)大獎(jiǎng)和一項(xiàng)SMT雜志的最佳國際會(huì)議論文獎(jiǎng)。2002年榮獲SMTA杰出會(huì)員，2003年榮獲Soldertec的無鉛合作獎(jiǎng)。2006年榮獲CPMT特殊技術(shù)成就獎(jiǎng)。他就職于SMTA執(zhí)行董事會(huì)。此外，他還是《焊接與表面組裝技術(shù)》、《世界SMT與封裝》的編輯顧問，和IEEE電子封裝制造的副編輯。他有眾多的出版物以及經(jīng)常應(yīng)邀在全世界許多國際會(huì)議或者討論會(huì)上作學(xué)術(shù)報(bào)告，發(fā)表演講和簡短課程。

誰應(yīng)該參加此課程：
任何對(duì)關(guān)心實(shí)現(xiàn)高直通率和高可靠性的無鉛焊點(diǎn)及想了解如何實(shí)現(xiàn)的相關(guān)人員都應(yīng)該參加。
Any one who care about achieving high yield and high reliability lead-free solder joints and like to know how to achieve them should take this course.

老師介紹：李寧成博士 1986年至今，任職于美國銦科技公司，現(xiàn)任該公司副總裁。在此之前，任職于Wright Patterson空軍基地材料實(shí)驗(yàn)室（1981-1982），Morton化學(xué)（1982-1984）和SCM（1984-1986）。他在SMT助焊劑和焊錫膏方面有20多年的研究經(jīng)驗(yàn)。此外，他在底部填充膠和粘接劑方面有著豐富的經(jīng)驗(yàn)�，F(xiàn)今，他的研究領(lǐng)域涉及到電子和光電子的互聯(lián)與封裝應(yīng)用的先進(jìn)材料，并且側(cè)重于高性能與低成本。
李寧成博士于1981年在美國阿克倫城大學(xué)獲得結(jié)構(gòu)-性質(zhì)關(guān)系聚合體科學(xué)博士學(xué)位。1976年，他在Rutgers 大學(xué)專修有機(jī)化學(xué)。1973年他在臺(tái)灣國立大學(xué)獲得化學(xué)學(xué)士學(xué)位。
李寧成博士最新出版了《再流焊工藝和缺陷偵斷：SMT，BGA，CSP和Flip Chip技術(shù)》。合著編寫了《無鉛，無鹵素和導(dǎo)電膠材料的電子制造》。同時(shí)，他還編寫了一系列關(guān)于無鉛焊接書籍的章節(jié)。他榮獲SMTA兩項(xiàng)大獎(jiǎng)和一項(xiàng)SMT雜志的最佳國際會(huì)議論文獎(jiǎng)。2002年榮獲SMTA杰出會(huì)員，2003年榮獲Soldertec的無鉛合作獎(jiǎng)。2006年榮獲CPMT特殊技術(shù)成就獎(jiǎng)。他就職于SMTA執(zhí)行董事會(huì)。此外，他還是《焊接與表面組裝技術(shù)》、《世界SMT與封裝》的編輯顧問，和IEEE電子封裝制造的副編輯。他有眾多的出版物以及經(jīng)常應(yīng)邀在全世界許多國際會(huì)議或者討論會(huì)上作學(xué)術(shù)報(bào)告，發(fā)表演講和簡短課程。
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981-1982), Morton Chemical (1982-1984), and SCM (1984-1986). He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
He received his PhD in polymer science on structure-property relationships from University of Akron in 1981. Prior to Akron period, he has studied organic chemistry at Rutgers University in 1976. He received a BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received two awards from SMTA and one from SMT Magazine for best proceedings papers of international conferences. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the board of director for SMTA. Among other editorial responsibilities, he serves as one of the editorial advisory boards of Soldering & Surface Mount Technology, Global SMT & Packaging, and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited seminars, keynote speeches, and short courses worldwide on those subjects at many international conferences or symposiums.

本課程將涵蓋以下主題：
1. 表面處理問題
(1) 裂縫腐蝕
(2) 各種表面處理的品質(zhì)和性能
(3) 各種表面處理的可靠性比較
2. 錫須 – 長期的威脅
(1) 錫須產(chǎn)生的原理
(2) 錫須的測(cè)量
(3) 錫堆積物殘余應(yīng)力測(cè)量
(4) 量化錫須的結(jié)晶及增長
(5) 加速錫須測(cè)試
(6) 錫須緩和: 使用者視角
3. 波峰焊及選擇性波峰焊
(1) 針對(duì)波峰焊和選擇性波峰焊的設(shè)計(jì)
(2) 助焊劑的選擇和應(yīng)用
(3) 合金類型對(duì)銅腐蝕及焊接的影響
(4) 流程參數(shù)和優(yōu)化的影響
(5) 大而厚的板子 - 通孔的填充和空
洞對(duì)可靠性的影響
4. 返工
(1) 減少不良的期望流程。
(2) 銅移除的維修參數(shù)和合金類型。
(3) 維修次數(shù)及合金類型對(duì)可靠度的影響。
(4) BGA & LCC的維修
(5) 低mp合金 1. Issues of Surface Finish
(1) Creep corrosion
(2) Quality and performance of various surface finishes
(3) Comparison of reliability of various surface finishes
2. Tin Whisker – The Lingering Threat
(1) Formation mechanism of Tin Whiskers
(2) Measurement of Tin Whiskers
(3) Residual Stress Measurement of Sn Deposits
(4) Quantifying the Role of Stress on Whisker Nucleation and Growth
(5) Accelerated Tin Whisker Test
(6) Tin Whisker Mitigation: User Perspective
3. Wave and Selective Soldering
(1) Design for wave and selective soldering
(2) Flux selection and application
(3) Effect of alloy type on Cu erosion and soldering
(4) Effect of process parameters and optimization
(5) Large thick board - Effect of hole fill and voiding on Reliability
4. Rework
(1) Desired process for reducing defects
(2) Rework parameters and alloy type on Cu removal
(3) Effect of rework cycles and alloy type on reliability
(4) Rework on BGA & LCC
(5) Low mp alloys for rework

5. 怎么處理混合合金
(1) 運(yùn)送可靠性
(2) 外部可靠度
(3) 流程優(yōu)化
6. 替換的無鉛焊料合金
(1) 低Ag合金
(2) 高Cu合金
(3) 低溫焊膏
(4) 新型合金
(5) 組合的堅(jiān)固和耐熱的特征
(6) 選擇和評(píng)估新合金的策略
7. 便攜設(shè)備可靠性
(1) 裂紋擴(kuò)展
(2) 脆性失效原理
(3) 塑料變形和壽命限制
(4) 合金類型和微量添加劑對(duì)于沖擊可靠性的影響
(5) BGA 風(fēng)險(xiǎn)評(píng)估
8. 關(guān)于可靠性的新發(fā)現(xiàn)
(1) 無鉛焊膏的機(jī)械性能
(2) 成分，焊盤金屬化和流程的狀態(tài)冷卻率的影響
(3) Ni對(duì)彎曲的影響
(4) 老化溫度和保留時(shí)間的影響
(5) 連接的大小和翹曲的影響
(6) 顆粒大小比例系數(shù)和質(zhì)地的影響
(7) 錫顆粒數(shù)量和方向的影響
(8) 保養(yǎng)環(huán)境的影響
(9) 微孔的構(gòu)造
(10) 破裂機(jī)構(gòu)和縫隙的增長
(11) 焊盤脫落
(12) 震動(dòng)測(cè)試的可靠性
(13) 錫須增長 - 結(jié)晶結(jié)構(gòu)大小的影響 
5. How to Handle Mixed alloys
(1) Forward reliability
(2) Backward reliability
(3) Process optimization
6. Alternative Lead-Free Solder Alloys
(1) Low Ag alloys
(2) High Cu alloys
(3) Low temperature solder
(4) Novel new alloys
(5) Combined non-fragility and thermal fatigue features
(6) Strategy in selecting and evaluating new alloys
7. Portable Devices Impact Reliability
(1) Crack propagation
(2) Brittle failure mechanism
(3) Plastic deformation & life prediction
(4) Effect of alloy type and micro-additives on impact reliability
(5) BGA risk assessment
8. New Findings on Reliability
(1) Mechanical properties of lead-free solder
(2) Effect of composition, pad metallization, and process condition & cooling rate
(3) Effect of Ni addition on bending
(4) Effect of aging temp and dwell time
(5) Effect of joint size and warpage,
(6) Effect of scaling factor on grain size and texture
(7) Effect of tin grain number and orientation
(8) Effect of service environment
(9) Microvoid formation
(10) Fracture mechanism and fatigue crack growth
(11) Pad crater failure
(12) Vibration Test reliability
(13) Creep – effect of size on crystal structure

更多無鉛生產(chǎn)所帶來的問題及解決方法培訓(xùn)班相關(guān)課程：